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Odisha lays foundation stone for India's first glass substrate chip packaging plant
Odisha's Info Valley in Bhubaneswar hosted the foundation-stone ceremony for India's first glass substrate chip packaging plant by 3D Glass Solutions. The ₹1,943-crore facility will use 3D Heterogeneous Integration technology and is expected to produce thousands of substrates and modules annually, boosting the nation's semiconductor packaging capabilities.
Why It Matters
The project signals a move toward a self-reliant semiconductor ecosystem in India, diversifying Odisha's economy into high-tech manufacturing and strengthening domestic packaging capabilities alongside other SiC fabrication efforts.
Timeline
2 Events
Foundation stone laid for India's first glass substrate chip packaging plant
April 19, 2026
Odisha chief minister Mohan Charan Majhi laid the foundation stone for the glass substrate chip packaging unit at Info Valley in Bhubaneswar. The facility, developed by US-based 3D Glass Solutions Inc. (3DGS), is valued at ₹1,943 crore and will deploy 3D Heterogeneous Integration (3DHI) packaging technology. It will annually produce 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules, and is expected to create over 2,500 direct and indirect jobs. The project marks India's first glass substrate packaging facility and represents a shift from traditional organic packaging toward glass interposers and embedded glass substrates. The 3DGS plant is the second semiconductor facility in Odisha within months; SiCSem Private Limited, in collaboration with UK-based Clas-SiC Wafer Fab Ltd., is already building India's first commercial silicon carbide (SiC) fabrication unit in the Info Valley campus.
Union cabinet approves Odisha semiconductor projects (3DGS and SiCSem)
2025
The Union cabinet approved both Odisha semiconductor projects in 2025 as part of a broader push that has greenlit 10 semiconductor projects nationwide, with cumulative investments exceeding ₹1.6 lakh crore.